Features for the CC256XSTBTBLESW
- Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royalty free
- The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
- Fully Thread safe
- Supports threaded (RTOS) and non-threaded (No OS) environment
- Fully Documented API Interface
- Works with any STM32F4 MCU
- Sample Apps are available for the STM3240G-EVAL MCU development kit with the support of the CC256XEM-STADAPT
- Protocols/Profiles can be selectively enabled/disabled
- Supports Keil and IAR IDEs
- Classic Profiles Available
- Advanced Audio Distribution Profile (A2DP): A3DP Implementation
- Audio/Video Remote Control Profile (AVRCP)
- Device ID Profile (DI)
- Generic Access Profile (GAP )
- Generic Audio/Video Distribution Profile (GAVDP)
- Headset Profile (HSP)
- Hands Free Profile (HFP)
- Human Interface Device Profile (HID)
- Phonebook Access Profile (PBAP)
- Serial Port Profile (SPP)
- Bluetooth Low Energy Profiles Available
- Alert Notification Service (ANS)
- Alert Notification Profile (ANP)
- Battery Service (BAS)
- Device Information Service (DIS)
- Find Me Profile (FMP)
- Generic Access Profile Service (GAPS)
- Generic Attribute Profile (GATT)
- Health Thermometer Service (HTS)
- Health Thermometer Profile (HTP)
- Heart Rate Service (HRS)
- Heart Rate Profile (HRP)
- Human Interface Device Service (HIDS)
- HID over GATT Profile (HOGP)
- Immediate Alert Service (IAS)
- Link Loss Service (LLS)
- Phone Alert State Service (PASS)
- Phone Alert State Profile (PASP)
- Proximity Profile (PXP)
- TX Power Service (TPS)
Description for the CC256XSTBTBLESW
TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 and QDID 69886), provides simple command line sample applications to speed development, and upon request has MFI capability.
For a complete evaluation solution, the CC256XSTBTBLESW works directly with the hardware development kit: STM3240G-EVAL. Moreover the stack that is available for the STM32 MCU, is certified and royalty-free (CC256XSTBTBLESW).
The software works with all CC256x EM boards (CC256XQFNEM and CC2564MODNEM) which provide a complete Bluetooth BR/EDR/LE HCI solution, reducing design effort and enabling fast time to market. The CC256x EM boards include TI's seventh-generation Bluetooth core and provide a product-proven solution that is Bluetooth 4.1 compliant. The devices provide best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.