This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET™ device has been designed to deliver the lowest on-resistance and gate
charge in the smallest outline possible with excellent thermal characteristics in an ultra-low
profile. The Land Grid Array (LGA) package is a silicon chip scale package with metal pads instead
of solder balls.
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