The dual-mode Bluetooth CC2564 module evaluation board (CC2564MODNEM) and CC256xEM Bluetooth adapter kit (CC256XEM-STADAPT) bundle provides an easy-to-use hardware solution to evaluate TI Bluetooth solution on the STM32 MCU evaluation boards (STM3240G-EVAL and STM32F4DISCOVERY - Sold separately).
The dual-mode Bluetooth CC2564 module evaluation board (CC2564MODNEM) is intended for evaluation purposes and works with TI hardware development kits such as MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C123G, and DK-TM4C129X. The dual-mode Bluetooth CC2564 module is a complete BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation core, the device brings a product-proven solution that supports 4.1 dual mode (BR/EDR/LE) protocols.
The CC256xEM Bluetooth adapter kit (CC256XEM-STADAPT) is a connector board aimed to help evaluate TI’s CC256x Bluetooth and dual-mode solution with STM32 MCUs. The CC256XEM-STADAPT board serves as a translation board between a CC256xEM board (CC256XQFNEM and CC2564MODNEM) and a STM32 MCU evaluation board (STM3240G-EVAL and STM32F4DISCOVERY).