See datasheet for actual packaging/pinout drawings

LDC1314EVM


LDC1314 Evaluation Module

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Texas Instruments LDC1314EVM

The LDC1314 Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes two example PCB sensor coils but can connect to the four channels of the LDC1314. An MSP430 microcontroller is used to interface the LDC to a host computer.

This module is designed to provide the user with maximum flexibility for system prototyping. It is perforated at two locations: one, between the PCB sensor coil (LC tank) and the LDC1314, and another, between the LDC1314 and the MSP430 interface. The first perforation gives the user the option to snap off the PCB coils from the module and experiment with custom sensor coils. The second perforation allows the user to connect the LDC1314 and sensor coils to a different microcontroller system or use multiple such sensors in one system.

An accompanying GUI allows for maximum flexibility and quick system prototyping.

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