The LMZ31503 power module is an easy-to-use integrated power solution that combines a 3-A
DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN
package. This total power solution allows as few as 3 external components and eliminates the loop
compensation and magnetics design process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a
compact point-of-load design with up to 95% efficiency and excellent power dissipation with a
thermal impedance of 13°C/W junction to ambient. The device delivers the full 3-A rated output
current at 85°C ambient temperature without airflow.
The LMZ31503 offers the flexibility and the feature-set of a discrete point-of-load
design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a
robust and reliable power solution compatible with standard QFN mounting and testing
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