The LMZ31506H power module is an easy-to-use integrated power solution that combines a
6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile,
QFN package. This total power solution allows as few as 3 external components and eliminates the
loop compensation and magnetics part selection process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a
compact point-of-load design with greater than 90% efficiency and excellent power dissipation with
a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output
current at 85°C ambient temperature without airflow.
The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load
design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a
robust and reliable power solution compatible with standard QFN mounting and testing
View datasheet View product folder