The LMZ31530 power module is an easy-to-use integrated power solution that combines a
30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN
package. This total power solution allows as few as three external components and eliminates the
loop compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and
allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load
step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The
LMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal
for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and
reliable power solution compatible with standard QFN mounting and testing techniques.
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