The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-A
DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN
package. This total power solution allows as few as three external components and eliminates the
loop compensation and magnetics part selection process.
The 10x10x4.3 mm QFN package is easy to solder onto a printed circuit board and allows a
compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation
capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibility and the
feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and
systems. Advanced packaging technology affords a robust and reliable power solution compatible with
standard QFN mounting and testing techniques.
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