The LMZ31710 power module is an easy-to-use integrated power solution that combines a
10-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low-profile QFN
package. This total power solution allows as few as three external components and eliminates the
loop compensation and magnetics part selection process.
The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and
allows a compact point-of-load design. The device achieves greater than 95% efficiency and
excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31710 offers
the flexibility and the feature set of a discrete point-of-load design and is ideal for powering a
wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power
solution compatible with standard QFN mounting and testing techniques.
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