The MSP-FET is a powerful flash emulation tool to quickly begin application development on the MSP430 MCU. It includes USB debugging interface used to program and debug the MSP430 in-system through the JTAG interface or the pin saving Spy Bi-Wire (2-wire JTAG) protocol. The flash memory can be erased and programmed in seconds with only a few keystrokes, and since the MSP430 flash is ultra-low power, no external power supply is required.
The debugging tool interfaces the MSP430 to the included integrated software environment and includes code to start your design immediately. The MSP-FET development tools supports development with all MSP430 flash devices.
The MSP-TS430RHA40A is a standalone 40-pin ZIF socket target board used to program and debug the MSP430 in-system through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol. The development board supports all MSP430FR5xxx FRAM parts in a 40-pin QFN package (TI package code: RHA).
MSP430FR57xx MCU with FRAM soldering guidance:
Higher temperature exposure to FRAM may impact the first initial memory read. Therefore during board soldering it is recommended to follow the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. Programming of devices with user application code should only be performed post reflow soldering. Factory programmed information such as calibration values are designed to withstand the temperatures normally reached in the current JEDEC J-STD-020 specification.
In general, hand soldering is not recommended. However, if hand soldering is required for application prototyping, peak temperature must not exceed 250°C for longer than 30 seconds durations. In addition, user application code should not be programmed prior to hand soldering.
The ECCN (Export Control Classification Number) classification for this tool will be the same as the included microcontrollers. To find ECCN information for a microcontroller, see the datasheet for that device.
Any use made of Texas Instruments (TI) classifications, whether it be ECCNs or HTS, is without recourse to TI and at the user’s risk. HTS and export classifications are subject to change. Your company, as the exporter of record, is responsible for determining the correct classification of any item at the time of export. Any HTS or export classification by TI is for TI’s internal use only and shall not be construed as a representation or warranty regarding the proper export classification nor relied upon to make licensing determinations.