See datasheet for actual packaging/pinout drawings

PAN1323EMK


PAN1323 Bluetooth Evaluation Module Kit

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Unit price: $84.56

Texas Instruments PAN1323EMK

The PAN1323 Evaluation Module Kit (kit) is a highly versatile, advanced TI Bluetooth ® development tool.   The kit, when coupled with 2 MSP430F5438A Experimenter boards, enables early software and hardware prototyping capabilities for wireless embedded applications.

Users may download the Bluetooth software named MSP430+CC2560 Software Development Kit (SDK) which includes Mindtree's Ethermind Bluetooth stack, serial port profile (SPP) and embedded sample applications running on Free RTOS.  One of the sample applications uses the accelerometer onthe Experimenter board to remotely control a PC based game.  The SDK also includes sample applications for transmitting temperature readings between Bluetooth devices and displaying RF link quality parameters on the Experimenter board LCD.  The combination of sample applications in source format and the peripheral rich Experimenter board makes this platform a versatile tool for extensive prototyping and easy development of applications that want to use Bluetooth connectivity.

This kit is an upgraded version of the PAN1315EMK.  The PAN1323 ETUs will be used for evaluation of different software configurations as they become available.  Possible combinations are Bluetooth classis, Bluetooth + ANT+ (separate kit available), and in the future  Bluetooth + BLE.  The PAN1323 that comes with the kit is for evaluation only. For production use, please use the Panasonic PAN1315, PAN1325, PAN1317 or PAN1327 modules.

For more details please visit our wiki
http://processors.wiki.ti.com/index.php/PAN1315EMK_User_Guide

For more information on Texas Instruments Wireless Connectivity, please visit
http://www.ti.com/wirelessconnectivity

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