See datasheet for actual packaging/pinout drawings

Packaging

Package | PIN:

DSF | 6

Temp:

I (-40 to 85)

ECO Plan:

Green (RoHS & no Sb/Br)

SN74AUP1G240DSFR


Low-Power Single Buffer/Driver with 3-State Output

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Texas Instruments SN74AUP1G240DSFR

The AUP family is TI’s premier solution to the industry’s low power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

This buffer/driver is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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