See datasheet for actual packaging/pinout drawings

Packaging

Package | PIN:

YFP | 8

Temp:

I (-40 to 85)

ECO Plan:

Green (RoHS & no Sb/Br)

SN74AUP2G125YFPR


Low-Power Dual Bus Buffer Gate With 3-State Outputs

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Texas Instruments SN74AUP2G125YFPR

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

The SN74AUP2G125 is a dual bus buffer gate designed for 0.8-V to 3.6-V VCC operation. This device features dual line drivers with 3-state outputs. Each output is disabled when the corresponding output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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