See datasheet for actual packaging/pinout drawings

Packaging

Package | PIN:

DCU | 8

Temp:

I (-40 to 85)

ECO Plan:

Green (RoHS & no Sb/Br)

SN74AUP3G17DCUR


Low-Power Triple Schmitt-Trigger Buffer

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Texas Instruments SN74AUP3G17DCUR

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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