The SN74LVC1G332 device performs the Boolean function in positive
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging
concepts, using the die as the package.
This device is fully specified for partial-power-down applications using
Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
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