Features for the TS3A226AEEVM
- Ground FET switches (60 mΩ typical)
- Autonomous detection of headset types:
- 3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
- Microphone line switches
- Supports FM signal transmission through the ground FETs
- Reduction of click and pop noise
- VDD range: 2.6 V to 4.7 V
- THD (MIC): 0.002% typical
- Low current consumption: 6.5 µA typical
- ±8-kV contract discharge (IEC 61000-4-2) ESD
- Performance on SLEEVE and RING2 pins
- YFF package
Description for the TS3A226AEEVM
The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio-headset switch. The EVM provides the basic functionality evaluation for theTS3A226AE device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.
The TS3A226AE is an audio-headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A226AE detects a certain configuration, the device automatically connects the microphone line to the appropriate pin.
If no microphone is available, the MIC signal from the codec is not connected and the ground of the audio jack is connected to the system ground through low-resistance FETs.
If the headset has a microphone pin, the pin is located in one of two possible locations (SLEEVE or RING2). This device detects the location of the microphone and routes the MIC from the codec to the correct pin. The ground of the jack will also be shorted to system ground through low resistance FET.
The TS3A226AE has two internal low-resistance (<100 mΩ) FET switches for ground shorting. The TS3A226AE also supports the FM signal transmission through this FET switches.