See datasheet for actual packaging/pinout drawings


Package | PIN:

YZ | 16


I (-40 to 85)

ECO Plan:

Green (RoHS & no Sb/Br)


2.7 V to 5.5V 12-Bit lead-free/green DAC in Bumped-Die (Wafer Chip Scale) Package

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Texas Instruments TLV5614IYZT

The TLV5614IYZ is a quadruple, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible 4-wire serial interface. The serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5614IYZ is programmed with a 16-bit serial word comprised of a DAC address, individual DAC control bits, and a 12-bit DAC value. The device has provision for two supplies: one digital supply for the serial interface (via pins DVDD and DGND), and one for the DACs, reference buffers, and output buffers (via pins AVDD and AGND). Each supply is independent of the other, and can be any value between 2.7V and 5.5V. The dual supplies allow a typical application where the DAC is controlled via a microprocessor operating on a 3V supply (also used on pins DVDD and DGND) with the DACs operating on a 5V supply. Of course, the digital and analog supplies can also be tied together.

The resistor string output voltage is buffered by a 2x gain rail-to-rail output buffer. The buffer features a Class-AB output stage to improve stability and reduce settling time. A rail-to-rail output stage and a power-down mode makes it ideal for single voltage, battery-based applications. The DAC settling time is programmable, allowing the designer to optimize speed versus power dissipation. Settling time is chosen by the control bits within the 16-bit serial input string. A high-impedance buffer is integrated on the REFINAB and REFINCD terminals to reduce the need for a low source impedance drive to the terminal. REFINAB and REFINCD allow DACs A and B to have a different reference voltage than DACs C and D.

The TLV5614IYZ is built with a CMOS process and is available in a 16-terminal bumped die (wafer chip scale) package. It is characterized for operation from -40°C to +85°C in a wire-bonded, small outline (SOIC) package.

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