The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the
temperature of an object without having to be in direct contact. The thermopile absorbs passive
infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined
field of view.
The corresponding change in voltage across the thermopile is digitized and reported with
the on-chip die thermal sensor measurement through an I2C- and
SMBus-compatible interface. With this data, the target object temperature can be calculated by an
The TMP007 is an enhanced version
of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an
additional math engine to perform all of the equations on chip, allowing the target object
temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile
memory for storing calibration coefficients.
The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is
possible to measure an object temperature beyond the device operating range as long as the device
itself does not exceed the operating temperature range (–40°C to +125°C).
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