See datasheet for actual packaging/pinout drawings

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TS3A226AEEVM-TS3A226AE Evaluation Module for Autonomous Audio Headset Switch

The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio headset switch. The EVM provides the basic functionality evaluation for the device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.

The TS3A226AE is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A226AE detects a certain configuration, the device automatically connects the microphone line to the appropriate pin.

If there is no microphone, the MIC signal from the codec is not connected and the audio jack’s ground is connected to system ground through low resistance FETs.

If the headset has a microphone pin, there are two possible locations for it(SLEEVE/RING2). This device detects the location of the microphone and routes the MIC from the codec to the correct pin. The ground of the jack will also be shorted to system ground through low resistance FET.

The TS3A226AE provides two internal low resistance (<100mΩ) FET switches for ground shorting. TS3A226AE also supports the FM signal transmission through this FET switches.

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