TS3USB3200EVM TS3USB3200EVM: USB 2.0 High-Speed and Mobile High-Definition Link Switch Evaluation Module top board image

TS3USB3200EVM

TS3USB3200EVM: USB 2.0 High-Speed and Mobile High-Definition Link Switch Evaluation Module

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Features for the TS3USB3200EVM

  • USB 2.0 Support
  • MHL Support
  • myDP Support
  • Integrated ID Switch

Description for the TS3USB3200EVM

The TS3USB3200EVM is an evaluation module for TI's 1:2 multiplexer/de-multiplexer high-performance USB/MHL/MyDP switch. The TS3USB3200 is specifically designed for high-speed signal switching that supports bidirectional operation and offers a high bandwidth (5.5 GHz typical). When interfacing other USB/MHL/MyDP devices with this EVM, the switch allows signals to pass with minimum edge and phase distortion as well as little or no signal attenuation.

The evaluation module is designed to demonstrate the small printed-circuit board (PCB) areas that can be achieved when designing with the TS3USB3200 switch. The TS3USB3200 offers the flexibility of powering from either a VCC rail (2.7 V to 4.3 V) or the VBUS power rail from the USB connector (4.75 V to 5.25 V)with the capability of switching between power rails using the PSEL pin.

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