The WL1837MODCOM8I is one of the two evaluation boards for the TI WiLink™ 8 combo module family that supports Wi-Fi®, Bluetooth® and Bluetooth Low Energy. The WL18xxCOM82SDMMC allows TI WiLink digital control interfaces to be attached, using generic SD/MMC connectors, to a host processor evaluation boards. This inexpensive bundle includes both these components. The processor board is sold separately.
The WL1837MODCOM8I operates in both the 2.4 GHz and 5 GHz frequencies, supports industrial temperatures, and is compatible with many processors including TI’s Sitara™ processors. It easily enables customers to add both Wi-Fi and Bluetooth/Bluetooth Smart capabilities to home and building automation, smart energy, gateways, wireless audio, enterprise, wearables, and many more industrial and Internet of Things (IoT) applications. TI’s WiLink 8 modules are certified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design.
The WL18xxCOM82SDMMC connects the WiLink COM8 evaluation modules and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides UART connection for Bluetooth over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module/chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437.
For additional tools to help you with your WiLink evaluation board and SD/MMC adapter board, visit
WiLink wiki page or our
E2E community page.