See datasheet for actual packaging/pinout drawings

Packaging

Package | PIN:

ABE | 244

Temp:

Q (-40 to 125)

ECO Plan:

XDM504XXBABE


SoC for Vision Analytics 12mm Package

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1 - 9 $ 32.20
10 - 15 $ 29.33

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Texas Instruments XDM504XXBABE

The DM504 is a highly optimized device for Vision Analytics and Machine Vision processing in very small form factor, light weight Industrial products such as drones, service robots and factory automation cameras. Utilizing a small package on package solution with capability to mount LPDDR2 and QSPI Flash memories in a stacked manner on top of the processor package reduces PCB board area. The Processor enables sophisticated embedded vision processing integrating an optimal mix of real time performance, low power, small form factor and camera processing for systems to interact in more intelligent, useful ways with the physical world and the people in it.

The DM504 incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power designs to meet demanding embedded system budgets without sacrificing real-time processing performance to enable small form factor designs. The DM504 also integrates a host of peripherals including interfaces for multi-camera input (both parallel and serial), display outputs, audio and serial I/O, CAN and GigB Ethernet AVB.

TI provides application specific hardware and software through our Design Network Partners and a complete set of development tools for the ARM, and DSP, including C compilers with TI RTOS to accelerate time to market.

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